| 摘要 |
PURPOSE:To improve brazing ability of a lead pin to a ceramic substrate, and to form a favorable fillet at the brazed part by a method wherein a brazing material is cladded to form the axial core part of the lead pin. CONSTITUTION:The material 12 to act as the brazing material is arranged to be cladded at the center of a material 11 used as the lead pin to form the lead pin 13 for the semiconductor. The pin 13 thereof is set on the ceramic substrate 5, and is heated in an electric furnace. Thereupon because the Fe-Ni alloy or the Fe-Ni-Co alloy used for the lead pin has inferior wetness between the alloy used for the brazing material, the melted Ag alloy drops according to empty weight. Then the dropped alloy enters uniformly into a scanty gap between the substrate 5 and the pin 13 from the central part toward the outside circumferential side according to the capillary phenomenon, and favorable brazing can be attained. Moreover, the favorable fillet is formed at the brazed part, crawling up on the outside circumferential face of the pin is not generated, and yield of brazing is improved. |
