| 摘要 |
PURPOSE:To reduce the bonding damage of a semiconductor device by a method wherein dummy pads are formed at the circumference of a bonding pad. CONSTITUTION:A lead wire 2 of aluminum, etc., being the same material with a bonding pad 1 is formed consecutively to the pad 1. The lead wire 2 thereof is connected to a circuit element (not shown in the figure) formed on the surface of a substrate 3. The dummy pads 11a-11c are provided on the surface of the substrate 3 at the circumference of the bonding pad 1. Accordingly a part of the protruded part of bonding balls 6a, 6b from the pad 1 is held by the dummy pads 11a-11c, and concentrated stress generated at the edges 7a-7d of the bonding pad 1 crossingly coming in contact with the bonding balls 6a, 6b can be mitigated sharply. |
