| 摘要 |
PURPOSE:To enable to bond a chip and a chip directly, and to enable to mount the chips in high density by a method wherein bonding pads of the pairs of two pieces are arranged on the upper face of the chip at the nearly mutually facing positions of both the mutually facing sides. CONSTITUTION:The bonding pads 4, 4' of the pairs of two pieces are arranged respectively on the chip 2 at the nearly mutually facing positions along both the mutually facing sides of the upper face of the chip 2. When the chips 2 thereof of the plural pieces are to be mounted placing on a ceramic substrate 1, because bonding can be performed directly between the respective chips, wirings to be provided on the substrate 1 can be reduced, and high density mounting can be attained. |
