发明名称 BRAZING METHOD OF LEAD PIN FOR SEMICONDUCTOR
摘要 PURPOSE:To braze surely to a ceramic substrate by a method wherein a material of at least one kind to act as a brazing material is plated on the necessary position on a ceramic substrate, and lead pins are set on the plated brazing material to be brazed in a furnace. CONSTITUTION:The prescribed positions on ceramics 1 are metalized 2, silver 8a of 8mum thickness and copper 8b of 2mum thickness are plated on plating 3 of the ceramic substrate 4 performed with electroless nickel plating 3 on the metalized parts 2 according to wet plating to obtain the brazing material 8. Then the lead pins 7 consisting of iron-nickel 42wt% are set on the plated brazing material 8 using a carbon jig 9, and brazing is performed in the conveyer furnace in the 850 deg.C hydrogen gas current.
申请公布号 JPS58184748(A) 申请公布日期 1983.10.28
申请号 JP19820068208 申请日期 1982.04.23
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 TSUJI HITOSHI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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