SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor device is disclosed which comprises: a semiconductor layer having a first semiconductor region of first conductivity type; a projection consisting of a single-crystalline silicon layer (46a, 51) formed on the surface of said semiconductor layer and a polycrystalline silicon layer contiguous therewith; an insulating film (52) formed on the surface of said projection; a second semiconductor region (46a) of second conductivity type formed at the lower part of said single-crystalline silicon layer; a third semiconductor region (51) formed at the upper part of said single-crystalline silicon layer and adjacent to said second semiconductor region (46a); a fourth semiconductor region (46b) of higher impurity concentration and the same conductivity type as said second semiconductor region (46a), said fourth semiconductor region (46b) formed in said first semiconductor region at both sides of said projection to be adjacent to said second semiconductor region (46a); and an interconnection electrode (54) connected with said fourth semiconductor region (46b) and insulated in from said third semiconductor region (51) by said insulating film (52).