| 摘要 |
<p>A conductive foam is obtained by blending 5 to 40 parts by weight of conductive carbon with 100 parts by weight of a resin component composed of 10 to 90 parts by weight of thermoplastic crystalline polyolefin resin and 10 to 90 parts by weight of low-crystallinity thermoplastic resin, crosslinking the resulting blend, and heating it to effect foaming. This foam has a good surface condition and is capable of deep drawing. It can be utilized as a material for semiconductor integrated circuit containers.</p> |
