Method for stress relieving in mounted circuit chips.
摘要
A method of relieving the stresses in elastically deformed semiconductor chips (10) soldered (20) to a substantially rigid substrate (15) by heating the assembly to and maintaining it at a temperature within the single phase region of the solder alloy employed to complete grain boundary sliding in the solder to thus permit the chip (10) to be restored to an unstressed state.
申请公布号
EP0092041(A2)
申请公布日期
1983.10.26
申请号
EP19830101747
申请日期
1983.02.23
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
FOUTS, DAVID PERRY;JASPAL, JASVIER SINGH;LLOYD, JAMES ROBERT;ROUSH, WALDEN BENNETT;SULLIVAN, MICHAEL JAMES