发明名称 Cu-Ag-Si Base alloy brazing filler material
摘要 PCT No. PCT/JP81/00338 Sec. 371 Date Jul. 30, 1982 Sec. 102(e) Date Jul. 30, 1982 PCT Filed Nov. 18, 1981 PCT Pub. No. WO82/02013 PCT Pub. Date Jun. 24, 1982.A Cu-Ag alloy brazing material that exhibits excellent cold workability, brazability and has a low vapor pressure is disclosed. The filler material comprises more than 35 to 50% by weight of Ag, 2.2 to 6% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.
申请公布号 US4411864(A) 申请公布日期 1983.10.25
申请号 US19820406236 申请日期 1982.07.30
申请人 MITSUBISHI KINZOKU KABUSHIKI KAISHA 发明人 MORIKAWA, MASAKI;YOSHIDA, HIDEAKI;KISHIDA, KUNIO;TANAKA, CHUJI
分类号 C22C5/06;B23K35/30;C22C5/08;C22C9/00;(IPC1-7):C22C30/02 主分类号 C22C5/06
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