发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a positive type photosensitive compsn. high in sensitivity and suitable for preparation of integrated circuits, by combining an alkali-soluble novolak resin with 1,2-quinonediazide compd. CONSTITUTION:A photosensitive resin compsn. contains an alkali-soluble novolak resin and a 1,2-quinonediazide compd. represented by formula I or II (R1, R3 are each alkyl, phenyl, or aralkyl; R2, R4, R5 are each 1,2-naphthoquinonediazide-4-sulfonyl group or 1,2-benzoquinone-4-sulfonyl group) at a I /II molar ratio of 1/9-9/1. The novolak resin to be used is prepared by addition condensing one of phenols with one of aldehydes, preferably, at a phenol-aldehyde ratio of 0.7-1 by mol in the presence of an acid catalyst.
申请公布号 JPS58182632(A) 申请公布日期 1983.10.25
申请号 JP19820065759 申请日期 1982.04.20
申请人 NIPPON GOSEI GOMU KK 发明人 HOSAKA YUKIHIRO;KAMOSHITA YOUICHI;HARITA YOSHIYUKI;HARADA TOKOU
分类号 C08G8/12;C08K5/41;C08L61/00;C08L61/04;C08L61/06;G03C1/72;G03F7/022;G03F7/039 主分类号 C08G8/12
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