| 摘要 |
PURPOSE:To readily and effectively measure by inputting and outputting a measurement signal through lead pins by connecting the ends of lead pins between adjacent semiconductor elements via molding insulator such as molding resin or the like, fixing it, thereby improving the mechanical strength of the lead pins. CONSTITUTION:The parts corresponding to lead pins 13 and a head are formed on a frame 12. A semiconductor element is mounted on a bed, the lement and the pins 13 are connected via bonding wirings between them. In this case, the pins 13 are commonly connected at the extension 22 of the frame 12. The extension 22 is isolated, and the ends of the pins 13 are molded with resin together with the element 11 at the step of molding. Accordingly, the element 11 is sealed, the pins 13 are commonly connected, and fixed to the frame 12. |
