LIGHT-EMITTING DIODE AND ITS LEAD FRAME

摘要

The lead frame for the light emitting diode and light emitting diode is provided to increase the maximum forward current by forming the lead frame member of the copper alloy and the diode suitable for the flat surface area of the lead cup. The LED lamp comprises the light emitting diode chip(1) radiating the light and the silver-plated metal lead frame(4). One silver-plated metal lead frame is a shape of the optical reflective surface having the inclined surface(4b) of the recessed shape to mount the light emitting diode chip. By using the conductive adhesives(2). The silver-plated lead cup flat plane is adhered to the light emitting diode chip. The lead frame(5) is connected with the light emitting diode chip by the bonding wire of the Au wire or the aluminum wire. The light emitting diode chip is mounted to the lead frame terminal. The light emitting diode chip is covered with to the epoxy resin or the silicon resin.