| 摘要 |
PURPOSE:To prevent short-circuit between terminals and corrosion of bonding pad by covering, on the occasion of casing semiconductor chip and a part of terminal electrically connected thereto through resin sealing, at least the area near to the root of terminals and the surface of resin case in vicinity of such terminals with other resin thin film. CONSTITUTION:A case 1 is structured by sealing semiconductor chip and terminal 2 connected electrically thereto with resin and the area 3 near to the root of terminal 2 and the surface of case 1 in the vicinity of root of said terminal 2 are covered with a resin thin film 5 consisting of the silicon resin, epoxy resin and polyimide resin, etc. Thereby, metal is precipitated on the surface of the case between terminals at the time of moisture proof test and crystal does not grow, and moreover water does not penetrate into the inside from the interface of terminal 2 and resin case 1. Thereby, corrosion of bonding pad can be prevented. |
