| 摘要 |
<p>A semiconductor light emitting module (A1) is provided with a semiconductor light emitting element (2), a case (3), a pair of leads (1A, 1B), a sealing resin (4) and lead covers (31, 32). The case (3) has a flare-shaped inner surface (3a) which surrounds the semiconductor light emitting element (2). Each of the leads (1A, 1B) has an inner end section including a flat surface electrically continuous to the semiconductor light emitting element (2). The sealing resin (4) is applied in a space surrounded by an inner surface (3a) of the case (3) and covers the semiconductor light emitting element (2). Lead covers (31, 32) cover the flat surface of each of the leads (1A, 1B), and has a flat reflecting surface which reflects light emitted from the semiconductor light emitting element (2).</p> |
