发明名称 HEAT TREATMENT DEVICE FOR SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To remove the damage of the semiconductor substrate, pollution by dust, etc., to improve the working ratio of a heat treatment furnace and the yield of a semiconductor device and to reduce cost by bringing the inner wall of a core pipe and a wheel for travelling of a boat into contact by a flat surface and providing a rail along which the wheel is supposed to advance. CONSTITUTION:The inner wall of the core pipe 1 is provided with the flat contact surface, on which the boats 3 travel, and the rails 4 along which the wheels for travelling must travel, and the boats can advance straight into the core pipe along the rails when the boats are inserted into the core pipe. Accordingly, the damage of the semiconductor substrate by falling and pollution by dust are prevented. Said rails are set up on the outsides of the wheels for travelling, but they may be positioned on the insides, and one wheel may be held by two rails. The rails are grooved, and the wheels for travelling may travel in said grooves.
申请公布号 JPS58180020(A) 申请公布日期 1983.10.21
申请号 JP19820063133 申请日期 1982.04.15
申请人 NIPPON DENKI KK 发明人 IIDA KIYOTO
分类号 H01L21/205;H01L21/22;H01L21/677 主分类号 H01L21/205
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