发明名称 HEAT TREATMENT DEVICE FOR SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To measure temperature distribution in a core pipe easily in the state of mounting by providing a heat treatment boat with a jig for measuring the internal temperature of the core pipe. CONSTITUTION:A quartz pipe 3 for a thermocouple is set up to the lower section of the boat 1, and the thermocouple 6 is inserted into the quartz pipe and the thermocouple 6 is inserted into the core pipe 4 at the same time as the boat 1 is inserted. Accordingly, when the boat 1 for heat treatment on which the semiconductor substrates 5 are loaded is inserted into the core pipe 4, the thermocouple 6 can be inserted into the core pipe 4 simultaneously, temperature distribution in the core pipe 4 can be measured under the state of mounting, the inconvenience of treatment is removed and the boat 1, the quartz pipe 3 for the thermocouple and the semiconductor substrates 5 are not damaged, and the working ratio of a heat treatment furnace can be improved and the cost of a semiconductor device is reduced.
申请公布号 JPS58180021(A) 申请公布日期 1983.10.21
申请号 JP19820063134 申请日期 1982.04.15
申请人 NIPPON DENKI KK 发明人 IIDA KIYOTO
分类号 H01L21/205;H01L21/00;H01L21/22;H01L21/677 主分类号 H01L21/205
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