Equipment for cutting hard and brittle material, in particular semiconductor material

摘要

The equipment comprises at least one cutting component, whose contact surfaces are provided with diamond granules, and a cooling and lubricating agent. According to the invention, a diamond impregnation (4) of at least a part of the contact surface is repeatedly interrupted in the direction of movement and an etchant and/or an electrolyte are provided as cooling and lubricating agent. This measure improves the known saws, and in particular, the cut losses and the damage depth are substantially reduced when cutting hard and brittle material. <IMAGE>