| 摘要 |
PURPOSE:To remarkably reduce the size of an electric part assembly by forming the prescribed circuit pattern on an insulating substrate, connecting chip-shaped microminiature electric parts, superposing a plurality of the substrates which are thus formed through insulating plates, and electrically connecting the parts via connecting conductors formed on the side faces of the plates. CONSTITUTION:A conductor layer forming the prescribed circuit pattern 2 is formed on an insulating substrate 1, and chip-shaped microminiature electric parts 3 are connected. Electrodes 4 which are connected to the patterns are provided on the side faces of the substrate 1. A plurality of the substrates 1 which are thus formed are superposed through insulating plates 5 on which connecting conductor layers 6 are formed only on the side faces, integrated with an adhesive, and connected as prescribed. In this manner, chip-shaped microminiature electric parts are stereoscopically disposed, thereby remarkably reducing the size of an electric part assembly and facilitating the manufacture. |
