| 摘要 |
PURPOSE:To be adapted for an automation without production of a solder bridge by projecting many leads of a terminal from a lead connecting strip toward one direction, adhering solder cream to the ends of the respective leads, temporarily fixing the leads to desired electrode pads by utilizing the adhesiveness of the cream and then heating to melt the cream. CONSTITUTION:Many leads 12 are projected as a lead terminal 13 from a lead connecting strip 11 toward one direction. At this time the leads 12 are disposed in parallel with each other at an interval of as narrow as approx. 1.3mm.. Then, the ends of the leads 12 are inserted into a solder cream tank 14 to adhere solder cream 15 only to the ends of the leads 12, and the ends of the leads 12 are contacted on desired electrode pads 17 formed at the peripheral end of an insulating substrate 16. In this case, the cream 15 is formed of fine solder particles and organic solvent such as paste, imparted with adhesiveness. Thereafter, the pad 17 is locally heated to melt the cream 15, thereby soldering the ends of the leads 12 to the pads 17. |
