| 摘要 |
Apparatus for mounting an integrated circuit module (2) on a printed wiring circuit board (3). The apparatus assembly (1) comprises electrical conducting members (10) for interconnecting the module with the circuit board and an insulating base (11) transversely mounting the electrical conducting members to position quadrilateral configurations of first and second spring contacts (102, 105) in planes parallel to top and bottom surfaces of the insulating base. A one piece cover (12, 42) engages the insulating base to spring clamp the module thereon and maintain each module terminal (20) in electrical engagement with a corresponding one of the first and second spring contacts.
|
