| 摘要 |
A curable thermosetting resin, especially suitable for RIM applications, comprising a blend of (a) 100 parts by weight of a polyepoxide, particularly a normally liquid polyepoxide and more particularly a glycidyl polyether of a polyhydric phenol, (b) from about 10 to about 200 parts by weight of at least one ethylenically unsaturated monomer, especially an aromatic monomer, and preferably styrene, (c) a curing amount of an aliphatic or cycloaliphatic polyfunctional amine or a polyamide, and (d) an effective amount of an amine-compatible free-radical initiator.
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