| 摘要 |
<p>PURPOSE:To provide the titled compsn. for electroless metal plating, which has good printability and excellent resistance to chemicals and heat and adhesion to cured film, consisting of a specified epoxy resin compsn. CONSTITUTION:100pts.wt. epoxy resin (A) such as Epikote 152 (a product of Shell International Chemicals Corp.) a hardener (B) for the epoxy resin (such as an arom. amine hardener in an amount of 0.5-1.5 equivalents per epoxy equivalent of epoxy resin and 5-30pts.wt. imidazole hardener), 1-35pts.wt. compd. (C) capable of reacting with the epoxy resin and improving water-resistant adhesion to copper foil, such as 2-mercaptothiazoline, a filler (D) such as fine talc powder, a thixotropic agent (E) such as fine SiO2 powder and an org. solvent (F) such as n-butyl cellosolve are mixed together. Pref. the resultant compsn. has a thixotropy index of 5-40 and a viscosity (a Brookfield viscometer, 1r.p.m. at 20 deg.C) of 800-1,000p.</p> |
