| 摘要 |
<p>PURPOSE:To enhance the moisture-proofness of electronic parts, by sealing said parts with an epoxy resin containing a silicon compound having a silanolic hydroxyl group or a hydrolyzable group and an aluminum complex as the hardener, as well as mica powder. CONSTITUTION:An epoxy resin composition is prepared by mixing an epoxy resin consisting of cresol novolac type epoxy resin, brominated epoxy novolac resin, and cycloaliphatic epoxy resin (Chisso-nox) with phenol novolac resin, a filler such as mica powder, crystal line silica powder, or quartz glass powder and a siloxane compound havig a hydroxyll-Si bond in its molecule, 2-(3,4-cyclohexenoxy)ethyltrimethoxysilane, triphenylsilanol, aluminum triethylacetoacetate, aluminum trissalicylaldehyde, carnauba wax, antimony trioxide, carbon black and 2-methylimidazole (hardening accelerator). Electronic parts are molded using the obtained composition.</p> |
