| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which allows stable operation of a semiconductor element.SOLUTION: A wiring board manufacturing method includes: a process of preparing an insulating substrate 1 having a cavity formation region X and a wiring formation region Y which surrounds the cavity formation region X; a process of forming a first wiring conductor 3a in the wiring formation region Y; a process of forming a cavity 5 in the cavity formation region X and forming in part of the wiring formation region Y in parallel, an opening K which links to the cavity 5; a process of inserting an electronic component D into the cavity 5 in a state where an external electrode T is adjacent to the opening K; a process of forming insulation layers 2a, 2b for filling the opening K on upper and lower surfaces of the insulating substrate 1, respectively; a process of forming a through hole 6b which passes the opening K from the insulation layer 2a on the upper surface side to the insulation layer 2b on the lower surface side and makes the external electrode T be exposed on an internal surface; and a process of forming a second wiring conductor 3b which is electrically connected to surfaces of the insulation layers 2a, 2b and the external electrode T exposed in the through hole 6b on the internal surface.SELECTED DRAWING: Figure 2 |
