CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit board achieving excellent heat radiation performance, and to provide a manufacturing method of the circuit board.SOLUTION: A thermal conductive structure 110 includes: a first structure 112 formed by a thermal conductive material; a second structure 113 formed by a thermal conductive material; and a structure insulation part 114 insulating the first structure from the second structure. At least one part of the thermal conductive structure 110 is inserted into an insulation part 120 of a circuit board 100.SELECTED DRAWING: Figure 1