发明名称 MOLDING POLYETHYLENE RESIN COMPOSITION
摘要 PURPOSE:The titled composition providing a film or sheet suitable as a base material for a corrison-resistant molded cover, etc., obtained by blending specific amounts of a low-density polethylene and a high-density polyethylene. CONSTITUTION:(A) 15-85pts.wt., preferably 40-60pts.wt. straight-chain low- density polyethylene by moderate or low pressure method having 0.91-0.93g/cm<3> density and 0.1-5 melt index is blended with (B) 85-15pts.wt., preferably 60-40 pts.wt. high-density polyethylene by low pressure method having >=0.945g/cm<3> density.
申请公布号 JPS62220537(A) 申请公布日期 1987.09.28
申请号 JP19860063001 申请日期 1986.03.20
申请人 NITTO ELECTRIC IND CO LTD 发明人 INAGAKI SADAYUKI
分类号 C08L23/06;C08L23/00;C08L101/00 主分类号 C08L23/06
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