| 摘要 |
An alignment device for the connecting wires (1a, 1b, 1c) of electronic components (1) has two alignment laminate sets (2 and 3) which can move with respect to one another and are guided parallel. The alignment laminate sets (2 and 3) have relatively long alignment laminates (2a, 2b and 3a, 3b respectively) which are constructed with acute-angled end surfaces (2f and 3h respectively) whose tips are allocated directly to the point at which the connecting wires (1a, 1b, 1c) emerge from the electronic component (1). Shorter alignment laminates (2c, 2d, 2e and 3c, 3d, 3e respectively), which are located opposite one another in pairs, are arranged on both alignment laminate sets (2 and 3), the end surfaces of which shorter alignment laminates are matched to one another and make direct contact with the connecting wires (1a, 1b, 1c). When the alignment laminate sets (2 and 3) run together, the longer alignment laminates (2a, 2b and 3a, 3b respectively) run between and to the side of the connecting wires (1a, 1b, 1c) and at the same time align them in a first direction. In the final position in which they have run together, the connecting wires (1a, 1b, 1c) are aligned in a second direction from the end surfaces of the mutually opposite alignment laminates (2c, 2d, 2e and 3c, 3d, 3e respectively), under pressure. <IMAGE>
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