Cooling device for information technology apparatuses

摘要

In information technology apparatuses, especially those which must be reliably screened against radio-frequency electromagnetic fields and are therefore accommodated in relatively sealed housings, it is difficult to dissipate the heat losses from high-power semiconductor components. A flexible metal strip consisting of a highly thermally conductive material is, on the one hand, pressed onto the contact surface of the semiconductor component provided for heat dissipation and, on the other hand, is mounted on the cooling surface of the housing in such a manner that the thermal resistance between the metal strip and the housing is small here as well.