REFLOW FURNACE FOR SOLDERING BOARD MOUNTING ELECTRONIC COMPONENT BY HEATING BOARD IN HOT-AIR, HOT-AIR CIRCULATION UNIT AND ATTACHMENT THEREOF AND BOARD HEATING METHOD

摘要

PROBLEM TO BE SOLVED: To improve variation of soldering of a printed circuit board mounting electronic components having a significant difference in heat capacity.SOLUTION: A hot-air circulation unit 10 has a hot-air guide tube 14 extending toward an electronic component 160(La) having a large heat capacity, out of the electronic component 160 mounted on a board W. The hot-air guide tube 14 guides hot-air to the electronic component 160(La) having a large heat capacity. The hot-air circulation unit 10 also has a suction tube 20 around the hot-air guide tube 14. The suction tube 20 has a function for sucking the hot-air discharged from the hot-air guide tube 14.SELECTED DRAWING: Figure 1