| 摘要 |
<p>PURPOSE:To contrive improvement in damp-proof property of the titled semiconductor device by a method wherein a sealing work is performed using the composition consisting of a specific quantity of CaCO3 and a proper quantity of hardener added to epoxy resin of 100pts.wt. CONSTITUTION:The CaCO3 of 0.20-0.25wt%, which passes 80 through 80 meshes, is added to phenol novolac type epoxy resin of 100pts.wt., a proper quantity of phenol novolak resin is added as a hardener and then imidazol compound is added as a hardening accelerator. Each component is uniformly melted and mixed and made into powdered form. The semiconductor device having excellent damp-proof property can be obtained by performing a transfer molding process using said resin powder.</p> |
