| 摘要 |
<p>PURPOSE:To prevent the outflow of a solder material, and to improve workability by attaching or burying heat-resistant resin rectilinearly or curvedly around a semiconductor element loading section on a substrate. CONSTITUTION:A concave section is formed to a metallic base or the ceramic substrate 1, and heat-resistant resin 6 such as polyimide is buried. When a chip 3 is loaded, the flow of excessive solder material 2 stops in a resin buried section. The flow can also be prevented when the section is buried convexedly with resin 6. According to the constitution, the workability of the loading of the chip is improved, and the quality and yield of products are enhanced.</p> |
