发明名称 METHOD OF PRODUCING POLYPHASE THERMAL CIRCUIT BREAKER AND POLYPHASE THERMAL CIRCUIT BREAKER PRODUCED BY SAME METHOD
摘要 Each bimetallic element is associated with one phase and is attached with one end thereof to a metallic support mounted at a wall of a housing. Each support comprises two supporting surfaces or faces lying in a plane which extends at right angles to the bending or deflection direction of the free ends of the bimetallic elements. When all the bimetallic elements have the same temperature, the distance of this plane from the bendable ends of the bimetallic elements is the same for all bimetallic elements. The supports are supported at counter surfaces or faces provided at the housing wall via a plate-shaped intermediate layer of the same thickness. The counter surfaces for all supports lie in a common plane extending at a distance, which corresponds to the thickness of the intermediate layer, from the plane defined by the supporting surfaces and in substantial parallelism thereto. By virtue of the design of the supporting surfaces and the counter surfaces there is ensured that the bendable free ends of all the bimetallic elements which act upon a common slider are aligned with respect to each other after the bimetallic elements have been assembled into the housing. Thus no re-adjustment is necessary.
申请公布号 JPS58172841(A) 申请公布日期 1983.10.11
申请号 JP19830047794 申请日期 1983.03.22
申请人 SHIYUPURETSUHERU UNTO SHIYUU AG 发明人 HAINRITSUHI HOFUMAN;KURUTO HENII;BUIRII FUERERU
分类号 H01H61/01;H01H61/00;H01H61/02;H01H69/01;H01H83/22 主分类号 H01H61/01
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