| 摘要 |
PURPOSE:To bond a fine wire instantaneously and surely to an electrode, by pressure welding the fine wire on an electrode by means of a pressing tool, irradiating laser light by means of said tool, and heating the pressure welding part locally. CONSTITUTION:A holding means 13 provided to the forward end of an osicillating arm 11 is moved downward by the effect of a cam 15 and a tension spring 17 while the semiconductor pellet 21 in a lead frame 28 is beforehand heated. The forward end of a wire 19 of aluminum or the like supplied from a wire supply device 18 is pressure welded onto the electrode 21a of the pellet 21 by a pressing tool 14 mounted on the means 13. The laser light emitted from a laser light source 25 is made incident to the tool 14 through a switching device 26 and an optical fiber 24. The tool 14 consists of a sectorial cross section of a light transmission member such as quartz glass and heats the pressure welding part by condensing the incident laser light, thereby bonding the wire 19 to the electrode 21a. |
