| 发明名称 |
SYSTEMS AND METHODS FOR DEVICE TEMPERATURE STABILIZATION |
| 摘要 |
A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layer over the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature. |
| 申请公布号 |
US2016233851(A1) |
申请公布日期 |
2016.08.11 |
| 申请号 |
US201514716635 |
申请日期 |
2015.05.19 |
| 申请人 |
Honeywell International Inc. |
发明人 |
Horning Robert D.;Lodden Grant H. |
| 分类号 |
H03K3/011;H01L35/32;H01L35/34 |
主分类号 |
H03K3/011 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A temperature stabilized device, comprising:
a substrate having a first surface; at least one component mounted on the first surface of the substrate; a first conformal layer comprising a thermoelectric material, the first conformal layer over the at least one component; and a first temperature control circuit electrically coupled to the first conformal layer, the first temperature control circuit configured to control a current through the first conformal layer; wherein the current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature. |
| 地址 |
Morristown NJ US |
