| 摘要 |
<p>PURPOSE:To enable an automatic assembling by forming an identification mark for identifying size accuracy of substrate with the same material as that for printing thick film resistance body to a substrate. CONSTITUTION:The timing marks 3, size identification marks 4, defective module identification marks 5 of automatic assembling machine are provided as the identification marks on a multi-segment hybrid IC ceramic substrate 1. These marks are printed with the same material as that for printing thick film resistance body. The size identification mark 4 is necessary for discriminating whether the substrate size corresponds to which size of L, M or S after the baking. This mark is recognized when a chip is mounted. Thereafter, a thick film is printed using three kinds of screen printing masks in accordance with each size and then parts are mounted.</p> |
