LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent metal thin film a lead frame thereof has been subjected to plating from being exposed out of the resin mold by fixing a metal piece at least at the surface side of the internal lead portion and by forming metal thin film at the surface of such metal piece. CONSTITUTION:A semiconductor pellet 4 is bonded to a semiconductor pellet mounting portion 3 having a metal thin film 2 and each lead of this pellet and a metal piece 7 of end point of internal lead 1 forming a lead frame are connected with a gold wire 5. A semiconductor device can be produced by mainly molding the semiconductor pellet 4 with resin 6. A metal thin film 2' is formed by the plating on the metal piece 7. The plating of metal thin film 2 of the mounting portion 3 must be performed before mounting the metal piece 7. As explained above, since the metal thin film 2 of mounting portion 3 and metal thin film 2' of metal piece 7 are formed individually, the metal thin film is not exposed out of the resin mold.