| 摘要 |
PURPOSE:To easily take out wafers by isolating, on the occasion of separating surface tables, wafers from the polishing cloth of the upper surface table through injection of pressurized fluid from the upper surface table and by firmly leaving wafers on the polishing cloth of the lower surface table. CONSTITUTION:When the polishing process has completed, the upper and lower surface tables 10, 12, a sun gear 24 and an internal gear 28 are stopped. While injecting the pressurized fluid such as a compressed air from the fluid injecting port 15 of the pressurized fluid source A through the flexible piping 21, flowing path 20, rotary joint 19, distributing pipe 22 and a vacant area 14, the upper surface table 12 is moved upward through the upper shaft 18. At this time, since the pressurized fluid injected from the fluid injecting port 15 flows into the upper surface of wafers 38 passing the polishing cloth 13, the wafers 38 are isolated from the polishing cloth 13 and it is firmly left on the lower polishing cloth 11 together with the carrier 36. |
