| 摘要 |
PURPOSE:To contrive the miniaturization and integration of a thermopile by a method wherein two materials for thermocouple are deposited successively on the same substrate, using photoetching and deposition methods of various kind of particles. CONSTITUTION:A constantan foil 2 is cut into rectangular shapes of required areas, and a substrate 9 made of heat resistant resin is adhered. Next, a group of filaments of the constantan 2 constituted of filament parts 2a and connection parts 2b is formed by performing photoetching. When the group of constantan filaments is finished to form, the filament parts 1a and connection parts 1b of copper 1 which is the other material are formed by a deposition method of heated particles. In other words, a mask 16 having through-holes cut off into the form of filament group is superposed on the substrate 9 whereon the group of constantan filaments 2 is formed, and the copper 1 thin film, i.e. the filament parts 1a and connection parts 1b are connected by being superposed by a vacuum evaporation method. Thereby, a thermopile wherein many filaments of the copper 1 and the constantan 2 are connected in series can be formed in small size. |
