| 摘要 |
Provided is a RF package and a manufacturing method thereof, which increases a degree of design freedom of an interconnecting structure in a RF package and improving performance. According to an embodiment of the present invention, the RF package comprises: a package base; a semiconductor die which is mounted on the package base; a package substrate which is formed on the package base and includes one or more defected substrate structures; and a conducting pattern which is formed on one surface of the package substrate and is electrically connected to the semiconductor die. The one or more defected substrate structures overlap at least one portion of the conducting pattern in a plan view point. |
