DEPRESSION FILLING METHOD AND PROCESSING APPARATUS

摘要

The present invention provides a method for filling a concave portion of an object to be treated. According to one embodiment of the present invention, the method comprises the following steps: forming a first thin film of a semiconductor material not substantially including impurities along a wall surface dividing and forming a concave portion; forming an epitaxial region according to a crystal of a semiconductor substrate from the semiconductor material of the first thin film moved toward a bottom of the concave portion by annealing the object to be treated in a container; etching the first thin film remaining on the wall surface of the concave portion; vapor doping the epitaxial region; forming a second thin film of the semiconductor material not substantially including impurities along the wall surface dividing and forming the concave portion; further forming an epitaxial region from the semiconductor material of the second thin film moved toward the bottom of the concave portion by annealing the object to be treated in the container; and vapor doping the second thin film remaining on the wall surface of the concave portion and the epitaxial region.