| 摘要 |
PURPOSE:To effectively form a soldering or connecting part of a semiconductor device by forming a groove at the periphery of a cavity of a substrate, or forming a rugged part on a lead terminal, thereby preventing resin for protecting a chip and a wire from flowing out to the soldering or connecting part forming region on the substrate. CONSTITUTION:A groove 8 is formed at the periphery of a cavity 7. The width of the groove 8 is formed in the width capable of readily flowing dropped rain into the groove and in the depth deeper than the depth of the cavity 7. Since the resin dropped on a chip 2 is always filled in the groove 8 by forming such a groove 8, the resin is prevented from expanding and flowing to the outer edge. Since the groove 8 is formed simultaneously upon forming of the cavity 7, excess steps are not required to form the groove 8. A rugged part may be formed on the part of a lead terminal which is positioned on the part to be formed with a groove instead of the formation of the groove 8. |
