摘要 |
PURPOSE:To completely guide a metal fine wire and to permit positive bonding by a device wherein a horn having a wedge at its one end and an ultrasonic vibrator at its the other end is arranged to be movable in the X, Y directions and in the theta direction. CONSTITUTION:Provided between a support 11 and an XY table 14 is turntable 15 causing the support 11 to be rotated in the horizontal direction. First, when a semiconductor pellet 2 is in a normal position as indicated by dotted lines, distances between the original Xo, Yo of a lead 3b and an electrode position xo, yo of the pellet 2 in both X, Y directions are detected to as to operate the table 14. Next, the wedge 7 is moved onto the electrode of the pellet 2 and at the same time an angle thetao of the original making with the electrode is determined so as to rotate the table 15 by the angle thetao. By so doing, since the guide direction of the metal fine wire 4 is made coincident with the direction of a groove 7b in the wedge 7, the fine wire 4 will not slip from the groove 7b when guiding the fine wire 4 toward the lead side after bonding on the electrode side, thereby ensuring positive bonding. In case the pellet 2 is shifted in position as indicated by solid lines, positive bonding can be also achieved in a similar manner. |