| 摘要 |
PURPOSE:To obtain a highly reliable resin sealing device by a method wherein recesses are formed at the specified intervals on the corner edge of a package, the bent point of leads is arranged in the recess, and an intermediate part is arranged on the main surface of the package at the prescribed distance. CONSTITUTION:Recesses 7 are provided at the prescribed intervals at the corner, which is formed by the main surface 8 and the side face 9 of the package, corresponding to the external lead 6. The bent point 6b of the lead is arranged in the recess 7, and an intermediate part 6a is positioned on the main surface 8 at the prescribed distance SO. As a result, no short-circuit is generated between the leads 6 which are adjoining each other, and as the point 6b is bent, the distance SO is not eliminated due to the pressure being applied from above, the lead 6 is supported by the part of length H, and the lead 6 moves with its base as the center point by having the interval G between the point 6b and the wall of the recess 7. Accordingly, after the leads 6 have been mounted on the substrate, the stress generated by the expansion and contraction of the substrate is absorbed by the elasticity of the leads 6. Also, as the under layer of resin 5 is formed in the width W which is narrower than that of the upper layer, the curvature of the package itself can be prevented. The titled semiconductor device of high quality can be obtained using the above constitution. |
