发明名称 ELECTRIC CONTACT MATERIAL
摘要 Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.
申请公布号 JPS58169715(A) 申请公布日期 1983.10.06
申请号 JP19830006527 申请日期 1983.01.18
申请人 RICHIYAADOSON CHEM CO 发明人 DONARUDO DABURIYUU BOODORANDO
分类号 H01H1/04;H01B1/02;H01H1/025;H01L23/48;H05K3/24 主分类号 H01H1/04
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