| 摘要 |
Provided are a packaging assembly and a preparation method thereof. The packaging assembly comprises a first substrate (1), a second substrate (2) arranged opposite the first substrate (1), an electronic component (3) located between the first substrate (1) and the second substrate (2), a protecting layer (4) covering the electronic component (3), a bonding layer (5) for bonding the first substrate (1) and the second substrate (2) to realize surface packaging. The packaging assembly also comprises: an isolating layer (6) arranged between the bonding layer (5) and the protecting layer (4), the isolating layer (6) is attached to the bonding layer (5) and the protecting layer (4) respectively. The adhesion force between a component material of the isolating layer (6) and a component material of the bonding layer (5) is smaller than that of a component material of the protecting layer (4) and the component material of the bonding layer (5). The above packaging assembly could achieve better packaging effect for the electronic component. |
