发明名称 REINFORCING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD AND REINFORCING DEVICE OF FLEXIBLE PRINTED CIRCUIT BOARD
摘要 The present invention relates to a method and a device for reinforcing a flexible printed circuit board which reinforce strength of a flexible board on a prescribed position of the flexible board and prevent electromagnetic interference (EMI) at the prescribed position. According to the present invention, the method for reinforcing a flexible printed circuit board comprises a preparatory hardening step, a main hardening step, and a finishing hardening step. The preparatory hardening step heats a flexible board in which a circuit is embedded and a reinforcing member to a first temperature while the reinforcing member is layered on a prescribed position of the flexible board. The main hardening step presses and heats the flexible board, the reinforcing member, and a bonding board to a second temperature higher than or equal to the first temperature while surrounding the flexible board which has undergone the preparatory hardening step with the bonding board. The finishing hardening step heats the flexible board and the reinforcing member which have undergone the main hardening step to a third temperature higher than or equal to the second temperature to fix the reinforcing member on the flexible board.
申请公布号 KR20160106406(A) 申请公布日期 2016.09.12
申请号 KR20150029277 申请日期 2015.03.02
申请人 KIM, TAE HEON 发明人 KIM, TAE HEON;RYU, JO HYEONG
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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