IMPROVED ELECTRONIC DEVICE HAVING MULTILAYER WIRING STRUCTURE

摘要

An improved electronic device having a multilayer wiring structure is provided. The interlayer insulation layer or at least one of the interlayer insulation layers, formed between metal wiring layers, is comprised of a cured coating of a ladder-type silsesquioxane polymer. A layer for protecting a metal wiring layer or layers may also be comprised of a cured coating of a similar polymer. The specified cured coating exhibits good resistance to heat and moisture and enhanced levelling on a pattern.