发明名称 |
Semiconductor device having radiator. |
摘要 |
<p>A semiconductor device having a radiator, which device comprises a semiconductor package and a radiator. The semiconductor package houses a semiconductor chip therein. The radiator comprises a pillar provided with a plurality of fins thereon. One end of the pillar is bonded to the semiconductor package. A hole is formed in the other end of the pillar and extends along the longitudinal direction of the pillar.</p> |
申请公布号 |
EP0090633(A2) |
申请公布日期 |
1983.10.05 |
申请号 |
EP19830301736 |
申请日期 |
1983.03.28 |
申请人 |
FUJITSU LIMITED |
发明人 |
WAKABAYASHI, TETSHUSHI;SUGIMOTO, MASAHIRO;MURATAKE, KIYOSHI |
分类号 |
H01L23/36;H01L23/367;H05K13/00;(IPC1-7):01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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