发明名称 CHARACTERISTIC MEASUREMENT OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the accuracy of a measuring test with a contacting property of measuring terminal by removing an oxide film with a friction caused between a contact pad and measuring terminal with an ultrasonic vibration. CONSTITUTION:Prior to the start of a measuring test, a lateral vibration is applied on a glass epoxy substrate 1 through a protection plate 11 with an ultrasonic vibrator 12 to cause a friction between the tip of a measuring terminal 10 with a spring and contact pads 210 and 310. As the measuring terminal 10 is kept contact with the contact pads by an elastic force of the spring 10b, a thin oxide film formed on the surface of the contact pads is removed by a friction force. Upon the removal of the oxide film, the ultrasonic vibrator 12 is halted and then, a main measuring test is conducted. Thus, the accuracy of the measuring test can be improved with a higher contacting property.
申请公布号 JPS58169068(A) 申请公布日期 1983.10.05
申请号 JP19820053454 申请日期 1982.03.31
申请人 TOKYO SHIBAURA DENKI KK 发明人 TODA KUNIO
分类号 G01R31/26;G01R1/073;H01L21/66 主分类号 G01R31/26
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