发明名称 PLATING APPARATUS
摘要 A discrete, precut strip, lead frame plating system wherein each strip is loaded onto a linked chain, located against plating masks, contacted electrically, plated, dried, and unloaded from the chain in successive sequential fashion.
申请公布号 JPS58167796(A) 申请公布日期 1983.10.04
申请号 JP19830027511 申请日期 1983.02.21
申请人 NATIONAL SEMICONDUCTOR CORP 发明人 JIERARUDO RABUAATEI;OOGASUTO KARIN;MAIKERU SEIFUAATO
分类号 C25D5/02;C25D7/00;C25D7/06;C25D17/28;H01L23/50 主分类号 C25D5/02
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