| 摘要 |
<p>PURPOSE:To minimize the mounting space while connecting the first and the second substrates to each other in only one process by a method wherein the first substrate arrayed with photoelectric conversion elements, common connecting interconnections, column and line interconnections and the second substrate arrayed with signal read-out circuits are arranged so that the respective side end may be opposed to each other to be electrically connected. CONSTITUTION:A band type photoelectric conversion layer 11 e.g. an amorphous silicon layer is formed in the long direction on the first substrate 10. One side electrode of the photoelectron conversion elements are common-connected by common connecting interconnections 12 per respective groups while the other side electrodes are individually connected to column interconnections 13. On the other hand signal read-out circuits 21 are made on the second substrate 20. Finally, the first substrate 10 and the second substrate 20 are fixed on a base substrate 30 using a bonding agent etc. so that the side end arrayed with the ends of common connecting interconnections 12 on the first substrate 10 and the other ends l4a of line interconnections 14 may be opposed to the other side end arrayed with the terminals 22a on the second substrate 20 to be electrically connected to each other by a connecting conductor 31.</p> |
